Copper Wire Bonding

被引：6
|
作者：
Mayer, Michael [1 ]
Lai, Yi-Shao [2 ]
机构：
[1] Univ Waterloo, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada
[2] Adv Semicond Engn Inc, Kaohsiung 81170, Taiwan
来源：
MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 01期
关键词：
D O I：
10.1016/j.microrel.2010.12.004
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1 / 2
页数：2
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