Bonding wire parameters

被引:0
|
作者
Greenelsh, Mike [1 ]
机构
[1] California Fine Wire, Grover Beach, United States
来源
Advanced Materials and Processes | 2000年 / 157卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:51 / 52
相关论文
共 50 条
  • [41] Review on Silver Wire Bonding
    Lu, Charlie
    2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2013, : 226 - 229
  • [42] NEW BONDING WIRE DEVELOPMENTS
    DOUGLAS, P
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 3 - 6
  • [43] Interconnection Challenge of wire bonding - Ag alloy wire
    Lan, Albert
    Tsai, Jensen
    Huang, Joseph
    Hung, Otis
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 504 - 509
  • [44] Modeling and Experimental Study of a Wire Clamp for Wire Bonding
    Wang, Fuliang
    Fan, Dengke
    JOURNAL OF ELECTRONIC PACKAGING, 2015, 137 (01)
  • [45] Copper Wire Bonding: A Review
    Zhou, Hongliang
    Chang, Andong
    Fan, Junling
    Cao, Jun
    An, Bin
    Xia, Jie
    Yao, Jingguang
    Cui, Xiaobin
    Zhang, Yingchong
    MICROMACHINES, 2023, 14 (08)
  • [46] BONDING WIRE MICROELECTRONIC INTERCONNECTIONS
    GEHMAN, BL
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (03): : 375 - 383
  • [47] Wire-bonding assembly
    Rachel Won
    Nature Photonics, 2018, 12 : 500 - 500
  • [48] A vision problem in wire bonding
    Noor, NM
    Rijal, OM
    Badar, OM
    Thon, PY
    IEEE 2000 TENCON PROCEEDINGS, VOLS I-III: INTELLIGENT SYSTEMS AND TECHNOLOGIES FOR THE NEW MILLENNIUM, 2000, : 299 - 304
  • [49] ADVANCEMENTS IN SILVER WIRE BONDING
    Manoharan, Subramani
    Patel, Chandradip
    McCluskey, Patrick
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017, 2017,
  • [50] ULTRASONIC BONDING OF INSULATED WIRE
    HULST, AP
    LASANCE, C
    WELDING JOURNAL, 1978, 57 (02) : 19 - 25