On the Problem of Analyzing Thermoelectrodynamic Processes in Three-Dimensional Integrated Circuits Operating at Superhigh and Extremely High Frequencies

被引：0
|
作者：
Gorbatkov, S. A.
Nefedov, E. I.
Parfenov, I. I.
机构：
来源：
Physics - Doklady | / 40卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Three-dimensional Integrated Circuits: Design, EDA, and Architecture
    Sun, Guangyu
    Chen, Yibo
    Dong, Xiangyu
    Ouyang, Jin
    Xie, Yuan
    FOUNDATIONS AND TRENDS IN ELECTRONIC DESIGN AUTOMATION, 2011, 5 (1-2): : 1 - 151
  • [22] Security Threats and Countermeasures in Three-Dimensional Integrated Circuits
    Dofe, Jaya
    Gu, Peng
    Stow, Dylan
    Yu, Qiaoyan
    Kursun, Eren
    Xie, Yuan
    PROCEEDINGS OF THE GREAT LAKES SYMPOSIUM ON VLSI 2017 (GLSVLSI' 17), 2017, : 321 - 326
  • [23] Laminated three-dimensional carbon nanotube integrated circuits
    Jian, Yang
    Sun, Yun
    Feng, Shun
    Zang, Chao
    Li, Bo
    Qiu, Song
    Li, Qing-Wen
    Yan, Xin
    Sun, Dong-Ming
    NANOSCALE, 2022, 14 (18) : 7049 - 7054
  • [24] Process technologies for three-dimensional optoelectronic integrated circuits
    Katayama, Yoshifumi
    Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 1993, 76 (02): : 14 - 22
  • [25] Multiwafer vertical interconnects for three-dimensional integrated circuits
    Lahiji, Rosa R.
    Herrick, Katherine J.
    Lee, Yongshik
    Margomenos, Alexandros
    Mohammadi, Saeed
    Katehi, Linda P. B.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2006, 54 (06) : 2699 - 2706
  • [26] Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
    Kandlikar, Satish G.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (02)
  • [27] EXTREMELY HIGH PACKAGING DENSITIES BY OPERATING INTEGRATED-CIRCUITS WITH RF POWER
    KRAUSE, G
    ELECTRONICS LETTERS, 1975, 11 (15) : 327 - 328
  • [28] High-resolution non-destructive three-dimensional imaging of integrated circuits
    Mirko Holler
    Manuel Guizar-Sicairos
    Esther H. R. Tsai
    Roberto Dinapoli
    Elisabeth Müller
    Oliver Bunk
    Jörg Raabe
    Gabriel Aeppli
    Nature, 2017, 543 : 402 - 406
  • [29] High-resolution non-destructive three-dimensional imaging of integrated circuits
    Holler, Mirko
    Guizar-Sicairos, Manuel
    Tsai, Esther H. R.
    Dinapoli, Roberto
    Muller, Elisabeth
    Bunk, Oliver
    Raabe, Jorg
    Aeppli, Gabriel
    NATURE, 2017, 543 (7645) : 402 - +
  • [30] Hybrid Three-Dimensional Integrated Circuits: A Viable Solution for High Efficiency Neuromorphic Computing
    Ehsan, M. Amimul
    Zhou, Zhen
    Yi, Yang
    2017 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2017,
12345