On the Problem of Analyzing Thermoelectrodynamic Processes in Three-Dimensional Integrated Circuits Operating at Superhigh and Extremely High Frequencies

被引:0
|
作者
Gorbatkov, S. A.
Nefedov, E. I.
Parfenov, I. I.
机构
来源
Physics - Doklady | / 40卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] InP-based three-dimensional photonic integrated circuits
    Tsou, D
    Zaytsev, S
    Pauchard, A
    Hummel, S
    Lo, YH
    ADVANCES IN MICROELECTRONIC DEVICE TECHNOLOGY, 2001, 4600 : 10 - 13
  • [42] Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits
    Ma, Yu
    Jia, Dingcheng
    Gao, Wei
    Zhou, Pingqiang
    2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2019,
  • [43] Thermal Via Structural Design in Three-Dimensional Integrated Circuits
    Hwang, Leslie
    Lin, Kevin L.
    Wong, Martin D. F.
    2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 103 - 108
  • [44] Charged Device Model Reliability of Three-Dimensional Integrated Circuits
    Shukla, Vrashank
    Rosenbaum, Elyse
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2015, 15 (04) : 559 - 566
  • [45] Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits
    Doghri, Ali
    Djerafi, Tarek
    Ghiotto, Anthony
    Wu, Ke
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (01) : 209 - 219
  • [46] Design Challenges in High Performance Three-Dimensional Circuits
    Friedman, Eby G.
    GLSVLSI 2009: PROCEEDINGS OF THE 2009 GREAT LAKES SYMPOSIUM ON VLSI, 2009, : 281 - 281
  • [47] Three-dimensional integrated circuits: Performance, design methodology, and CAD tools
    Das, S
    Chandrakasan, A
    Reif, R
    ISVLSI 2003: IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, PROCEEDINGS: NEW TRENDS AND TECHNOLOGIES FOR VLSI SYSTEMS DESIGN, 2003, : 13 - 18
  • [48] Study on Si-SiGe three-dimensional CMOS integrated circuits
    Hu, Huiyong
    Zhang, Heming
    Jia, Xinzhang
    Dai, Xianying
    Xuan, Rongxi
    Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2007, 28 (05): : 681 - 685
  • [49] Advances and Challenges in Polymer Three-Dimensional Photonic Integrated Circuits (Invited)
    Yin Yuexin
    Zhang Daming
    ACTA OPTICA SINICA, 2024, 44 (15)
  • [50] Wireless Transceiver for Three-Dimensional Integrated Circuits Using a Ring Oscillator
    Moon, Dongwoo
    Lee, Milim
    Lee, Changhyun
    Park, Joung-Hu
    Park, Changkun
    JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2020, 29 (10)