NEW PROCESS FOR PATTERNING PRINTED WIRING BOARDS.

被引：0

作者：

Beckenbaugh, W.M.

Dinella, D.

Polakowski, T.D.

机构：

来源：

Metal Finishing | 1982年 / 80卷 / 04期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

PRINTED CIRCUITS

引用

页码：21 / 26

共 50 条

[21] ON THE UTILITY OF INSULATION RESISTANCE TESTS TO ASSESS THE LIFE PERFORMANCE OF PRINTED WIRING BOARDS.
Eisenmann, E.T.
[J]. Circuit World, 1986, 12 (02) : 45 - 51
[22] New Technologies in the Manufacture of Printed Circuit Boards.
Michalski, Jerzy
[J]. Elektronika Warszawa, 1981, 22 (11-12): : 27 - 29
[23] CMOS Modules in Practice. Avoid Interference by Proper Design of Printed Wiring Boards.
Kozlowski, Roger
[J]. Elektronik Munchen, 1986, 35 (20): : 95 - 96
[24] New Fabrication Facilities for Printed-Circuit Boards.
Augsburg, Gunter
Hoffman, Manfred
Wuensche, Hatto
[J]. Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
[25] ROUTING OF PRINTED CIRCUIT BOARDS.
Aranoff, S.
Abulaffio, Y.
[J]. Proceedings - Design Automation Conference, 1981, : 130 - 136
[26] New Method of Computer Layout of Printed Circuit Boards.
Schenke, W.
[J]. Elektronik Produktion & Prueftechnik, 1981, (09): : 478 - 479
[27] NEW TYPE OF SEMIADDITIVE PROCESS FOR MANUFACTURING RELIABLE AND LOW COST PRINTED CIRCUIT BOARDS.
Kanou, Jirou
Endou, Akira
Ikari, K.
[J]. New Materials & New Processes, 1983, 2 : 424 - 429
[28] MECHANICAL DESIGN PROBLEMS ASSOCIATED WITH GLASS-REINFORCED POLYTETRAFLUORETHYLENE PRINTED-WIRING BOARDS.
Holden, William K.
[J]. RCA engineer, 1985, 30 (06): : 46 - 49
[29] Coating Varnishes for Printed Circuit Boards.
Olesen, S.T.
Villien, P.
Willumsen, A.
[J]. Elektronikcentralen (Report) ECR, 1979, (88):
[30] Inductive Soldering of Printed Circuit Boards.
Wolf, Hans-Juergen
[J]. ZIS Mitteilungen, 1973, 15 (04): : 413 - 418

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