NEW TYPE OF SEMIADDITIVE PROCESS FOR MANUFACTURING RELIABLE AND LOW COST PRINTED CIRCUIT BOARDS.

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作者：

Kanou, Jirou

Endou, Akira

Ikari, K.

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New Materials & New Processes | 1983年 / 2卷

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页码：424 / 429

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[1] Semiadditive Process for Manufacturing Printed Circuit Boards.
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[2] NEW PRINTED CIRCUIT BOARDS.
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[4] New Technologies in the Manufacture of Printed Circuit Boards.
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[5] ROUTING OF PRINTED CIRCUIT BOARDS.
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[6] New Fabrication Facilities for Printed-Circuit Boards.
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[7] New Method of Computer Layout of Printed Circuit Boards.
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[8] NEW PROCESS FOR PATTERNING PRINTED WIRING BOARDS.
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[9] Coating Varnishes for Printed Circuit Boards.
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[10] Inductive Soldering of Printed Circuit Boards.
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