Inductive Soldering of Printed Circuit Boards.

被引：0

作者：

Wolf, Hans-Juergen

机构：

来源：

ZIS Mitteilungen | 1973年 / 15卷 / 04期

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学科分类号：

摘要：

Description of the features and advantages of the technique of contactless inductive soldering and inductive high-frequency heating and its application to the manufacture of printed circuits.

引用

页码：413 / 418

共 50 条

[1] WAVE SOLDERING OF PRINTED CIRCUIT BOARDS.
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[J]. Journal of the Institution of Electronics and Telecommunication Engineers, 1975, 21 (07): : 386 - 388
[2] Soldering of SMD's on Printed Circuit Boards.
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[J]. 1600, (94):
[3] FLUXES FOR MASS-SOLDERING PRINTED CIRCUIT BOARDS.
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[J]. 1981,
[4] Printed Circuit Boards.
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[5] Use of an Infrared Bonding Facility for Efficient Soldering of Flexible Printed Circuit Boards.
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[J]. Schweisstechnik Berlin, 1987, 37 (05): : 196 - 197
[6] NEW PRINTED CIRCUIT BOARDS.
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[J]. 1600, (08):
[7] ROUTING OF PRINTED CIRCUIT BOARDS.
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[J]. Proceedings - Design Automation Conference, 1981, : 130 - 136
[8] Coating Varnishes for Printed Circuit Boards.
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[J]. Elektronikcentralen (Report) ECR, 1979, (88):
[9] Testing LSI Printed Circuit Boards.
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[J]. Messen und Pruefen, 1979, 15 (03): : 117 - 120
[10] Reflow Soldering as a Contacting Method for Joining Flat Conductors with Flat Printed Circuit Boards.
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Rank, Winfried
[J]. Schweisstechnik (Berlin), 1973, 23 (09): : 403 - 405

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