Use of an Infrared Bonding Facility for Efficient Soldering of Flexible Printed Circuit Boards.

被引：0
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作者：
Richter, Erhardt [1 ]
机构：
[1] Technische Univ Karl-Marx-Stadt, East Ger, Technische Univ Karl-Marx-Stadt, East Ger
来源：
Schweisstechnik Berlin | 1987年 / 37卷 / 05期
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页码：196 / 197
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