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- [1] ELECTROMIGRATION LIFETIME STUDIES OF SUBMICROMETER-LINEWIDTH AL-CU CONDUCTORSIEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (10) : 1468 - 1471IYER, SSTING, CY
- [2] Effects of texture and grain structure on electromigration lifetime of Al-Cu interconnectsMETALS AND MATERIALS INTERNATIONAL, 2001, 7 (04): : 303 - 310Park, YBLee, DW
- [3] ELECTROMIGRATION-INDUCED FAILURES IN THIN-FILM AL-CU CONDUCTORSJOURNAL OF ELECTRONIC MATERIALS, 1974, 3 (01) : 137 - 153AGARWALA, BNBERENBAUM, LPERESSININ, P
- [4] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORSJOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1487 - &AGARWALA, BNPATNAIK, BSCHNITZE.R
- [5] THE EFFECT OF MICROSTRUCTURE ON THE RESISTANCE TO ELECTROMIGRATION OF AL-CU THIN-FILM CONDUCTORSTHIN SOLID FILMS, 1991, 196 (01) : 47 - 63PATRINOS, AJSCHWARZ, JA
- [6] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORSJOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 283 - &AGARWALA, BNSCHNITZE.RPATNAIK, B
- [7] THE EFFECT OF PASSIVATION THICKNESS ON THE ELECTROMIGRATION LIFETIME OF AL/CU THIN-FILM CONDUCTORSJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1983, 1 (02): : 455 - 458LLOYD, JRSMITH, PM
- [8] Electromigration in nanometer Al-Cu interconnect linesJOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (02) : G103 - G108Pang, XKriman, AMBernstein, GH
- [9] ELECTROMIGRATION IN SPUTTERED AL-CU THIN-FILMSTHIN SOLID FILMS, 1983, 108 (01) : 95 - 102RODBELL, KPSHATYNSKI, SR
- [10] Simulation of electromigration induced atomic transport in Al-Cu alloysMATERIALS RELIABILITY IN MICROELECTRONICS IX, 1999, 563 : 65 - 70Dekker, JPElsässer, CGumbsch, P