共 50 条
- [31] Stacked film structured dependence of electromigration in Al-Cu interconnect terminated with W plug PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 1998, : 113 - 115
- [34] Effect of Ar sputtering pretreatment on the electromigration resistance in Al-Cu/TiN/Ti interconnects MATERIALS RELIABILITY IN MICROELECTRONICS VIII, 1998, 516 : 103 - 108
- [37] SPECTROSCOPIC STUDIES OF DISSIMILAR AL-CU LASER WELDING PROCEEDINGS OF THE ASME 13TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, 2018, VOL 2, 2018,
- [38] Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects J Appl Phys, 4 (1592):