ELECTROMIGRATION LIFETIME STUDIES OF SUBMICROMETER-LINEWIDTH Al-Cu CONDUCTORS.

被引:0
|
作者
Iyer, Subramanian S. [1 ]
Ting, Chung-Yu [1 ]
机构
[1] IBM, Thomas J. Watson Research Cent,, Yorktown Heights, NY, USA, IBM, Thomas J. Watson Research Cent, Yorktown Heights, NY, USA
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
下载
收藏
页码:1468 / 1471
相关论文
共 50 条
  • [31] Stacked film structured dependence of electromigration in Al-Cu interconnect terminated with W plug
    Matsumoto, S
    Etoh, R
    Ohtsuka, T
    Kouzaki, T
    Ogawa, S
    PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 1998, : 113 - 115
  • [32] Transmission electron microscopy of Al-Cu interconnects during in-situ electromigration testing
    Shih, WC
    Greer, AL
    THIN SOLID FILMS, 1997, 292 (1-2) : 103 - 117
  • [33] ACTIVATION-ENERGY FOR ELECTROMIGRATION FAILURE IN AL-CU CONDUCTOR STRIPES COVERED WITH POLYIMIDE
    LLOYD, JR
    STEAGALL, RN
    JOURNAL OF APPLIED PHYSICS, 1986, 60 (03) : 1235 - 1237
  • [34] Effect of Ar sputtering pretreatment on the electromigration resistance in Al-Cu/TiN/Ti interconnects
    Wang, LP
    Chuang, A
    Lin, LT
    Huang, FS
    Perng, K
    Hwang, J
    MATERIALS RELIABILITY IN MICROELECTRONICS VIII, 1998, 516 : 103 - 108
  • [35] ELECTROMIGRATION TESTING OF TI-W-AL AND TI-W-AL-CU FILM CONDUCTORS
    GHATE, PB
    BLAIR, JC
    THIN SOLID FILMS, 1978, 55 (01) : 113 - 123
  • [36] MICROCALORIMETRIC STUDIES OF THE AGEING OF AL-CU ALLOYS.
    TERZIEV, LYUBEN
    1981, V 29 (N 3-4): : 193 - 197
  • [37] SPECTROSCOPIC STUDIES OF DISSIMILAR AL-CU LASER WELDING
    Schmalen, Pascal
    Plapper, Peter
    PROCEEDINGS OF THE ASME 13TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, 2018, VOL 2, 2018,
  • [39] ROLES OF TI-INTERMETALLIC COMPOUND LAYERS ON THE ELECTROMIGRATION RESISTANCE OF AL-CU INTERCONNECTING STRIPES
    LEE, CC
    MACHLIN, ES
    RATHORE, H
    JOURNAL OF APPLIED PHYSICS, 1992, 71 (12) : 5877 - 5881
  • [40] Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects
    Kim, CU
    Morris, JW
    Lee, HM
    JOURNAL OF APPLIED PHYSICS, 1997, 82 (04) : 1592 - 1598