ELECTROMIGRATION LIFETIME STUDIES OF SUBMICROMETER-LINEWIDTH Al-Cu CONDUCTORS.

被引:0
|
作者
Iyer, Subramanian S. [1 ]
Ting, Chung-Yu [1 ]
机构
[1] IBM, Thomas J. Watson Research Cent,, Yorktown Heights, NY, USA, IBM, Thomas J. Watson Research Cent, Yorktown Heights, NY, USA
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1468 / 1471
相关论文
共 50 条
  • [21] EXAFS STUDIES ON AL-CU ALLOYS
    FONTAINE, A
    LAGARDE, P
    NAUDON, A
    RAOUX, D
    SPANJAARD, D
    PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANICS ELECTRONIC OPTICAL AND MAGNETIC PROPERTIES, 1979, 40 (01): : 17 - 30
  • [22] Electromigration damage due to copper depletion in Al/Cu alloy conductors
    Lloyd, JR
    Clement, JJ
    APPLIED PHYSICS LETTERS, 1996, 69 (17) : 2486 - 2488
  • [23] Improvement of electromigration lifetime of submicrometer dual-damascene Cu interconnects through surface engineering
    Vairagar, A. V.
    Gan, Zhenghao
    Shao, Wei
    Mhaisalkar, S. G.
    Li, Hongyu
    Tu, K. N.
    Chen, Zhong
    Zschech, E.
    Engelmann, H. J.
    Zhang, Sam
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (09) : G840 - G845
  • [24] Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnects
    Han, JH
    Shin, MC
    Kang, SH
    Morris, JW
    APPLIED PHYSICS LETTERS, 1998, 73 (06) : 762 - 764
  • [25] Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line
    Mazumder, MK
    Yamamoto, S
    Maeda, H
    Komori, J
    Mashiko, Y
    MICROELECTRONICS RELIABILITY, 2001, 41 (08) : 1259 - 1264
  • [26] Mass transportation through a side wall of Al-Cu interconnect during electromigration
    Matsumoto, S
    Etoh, R
    Kuriyama, H
    Kouzaki, T
    Ogawa, S
    STRESS INDUCED PHENOMENA IN METALLIZATION - FOURTH INTERNATIONAL WORKSHOP, 1998, (418): : 62 - 67
  • [27] Effects of texture and grain structure on electromigration lifetime of Al−Cu interconnects
    Young Bae Park
    Duk Won Lee
    Metals and Materials International, 2001, 7 : 303 - 310
  • [28] EFFECT OF Al/Cu WEIGHT FRACTION ON THE MECHANICAL AND ELECTRICAL PROPERTIES OF Al-Cu CONDUCTORS FOR OVERHEAD TRANSMISSION LINES
    Han, Deokhyun
    Kim, Geon-Hong
    Kim, Jaesung
    Ahn, Byungmin
    ARCHIVES OF METALLURGY AND MATERIALS, 2020, 65 (03) : 1019 - 1022
  • [29] Statistical mechanical studies of Al rich Al-Cu melts
    Mishra, Raj Kumar
    Lalneihpuii, R.
    Venkatesh, R.
    PHYSICA A-STATISTICAL MECHANICS AND ITS APPLICATIONS, 2020, 550 (550)
  • [30] Modeling the mechanisms of Cu-enhanced median time to failure in Al-Cu interconnects under electromigration
    Low, KS
    Shih, WC
    Greer, AL
    Ghiti, A
    ONeill, AG
    MATERIALS RELIABILITY IN MICROELECTRONICS VII, 1997, 473 : 317 - 322