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- [45] Package characterization and development of a flip chip QFN package: fcMLF 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 365 - 371
- [46] Thin Profile Flip Chip Package-on-Package Development 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 143 - 147
- [47] Development of thin flip-chip BGA for package on package 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 8 - +
- [48] μPILR™ package-on-package technology:: Development and reliability testing 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 55 - 60