共 50 条
- [35] Enhanced Package on Package with Coreless Substrate Optimal Design Evaluation 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [37] Development of Package-on-Package Using Embedded Wafer-Level Package Approach IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (10): : 1654 - 1662
- [39] EVALUATION OF A CARDIOVASCULAR LEARNING PACKAGE EUROPEAN JOURNAL OF CARDIOLOGY, 1974, 2 (02): : 239 - 244