Variable flip chip assembly for high-volume production

被引：0
|
作者：
Pajonk, Joachim [1 ]
Halk, David R. [2 ]
机构：
[1] Datacon Semiconductor Equipment GmbH, Radfeld, Austria
[2] Datacon North America Inc., Seven Neshaminy Interplex, Trevose, PA 19053
来源：
Advanced Packaging | 2004年 / 13卷 / 06期
关键词：
Anisotropically conductive adhesive (ACA) - Nonconductive adhesives (NCA) - Solder bump technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
页码：42 / 45
相关论文
共 50 条
  • [31] Post-enabled precision flip-chip assembly for variable MEMS capacitor
    Faheem, FF
    Hoivik, ND
    Lee, YC
    Gupta, KC
    2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2003, : 1927 - 1930
  • [32] Flip chip assembly with conductive adhesives
    Gilleo, K
    2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 256 - 260
  • [33] Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors
    Faheem, FE
    Gupta, KC
    Lee, YC
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (12) : 2562 - 2567
  • [34] High placement and levelling accuracy flip-chip assembly for MOEMS
    Quirke, C
    Lecarpentier, G
    NANO- AND MICROTECHNOLOGY: MATERIALS, PROCESSES, PACKAGING, AND SYSTEMS, 2002, 4936 : 76 - 81
  • [35] Low cost high-speed flip chip assembly processing
    Gutentag, C
    Dudderar, TD
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 188 - 192
  • [36] Redistribution and bumping of a high I/O device for flip chip assembly
    Keser, LA
    Bajaj, R
    Fang, T
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (01): : 3 - 8
  • [37] HIGH-SPEED DELIVERIES IMPROVE HIGH-VOLUME PRODUCTION
    LONG, TB
    INDUSTRIAL ENGINEERING, 1978, 10 (11): : 42 - 44
  • [38] Flip chip molding - High reliable flip chip encapsulation
    Braun, T
    Becker, KF
    Koch, M
    Bader, V
    Aschenbrenner, R
    Reichl, H
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 717 - 725
  • [39] High-volume ESPs restore oil production in Suriname
    Anthony, E.
    Granwde, G.
    Domangue, Michael
    OIL & GAS JOURNAL, 2009, 107 (38) : 35 - +
  • [40] Agent system application in high-volume production management
    Rehák, M
    Charvát, P
    Pechoucek, M
    EMERGING SOLUTIONS FOR FUTURE MANUFACTURING SYSTEMS, 2005, 159 : 193 - 200
12345