Variable flip chip assembly for high-volume production

被引：0

作者：

Pajonk, Joachim ^{[1
]}

Halk, David R. ^{[2
]}

机构：

[1] Datacon Semiconductor Equipment GmbH, Radfeld, Austria

[2] Datacon North America Inc., Seven Neshaminy Interplex, Trevose, PA 19053

来源：

Advanced Packaging | 2004年 / 13卷 / 06期

关键词：

Anisotropically conductive adhesive (ACA) - Nonconductive adhesives (NCA) - Solder bump technology;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

(Edited Abstract)

引用

页码：42 / 45

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