Variable flip chip assembly for high-volume production

被引：0
|
作者：
Pajonk, Joachim [1 ]
Halk, David R. [2 ]
机构：
[1] Datacon Semiconductor Equipment GmbH, Radfeld, Austria
[2] Datacon North America Inc., Seven Neshaminy Interplex, Trevose, PA 19053
来源：
Advanced Packaging | 2004年 / 13卷 / 06期
关键词：
Anisotropically conductive adhesive (ACA) - Nonconductive adhesives (NCA) - Solder bump technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
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页码：42 / 45
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