ETCHING MECHANISM OF SIO2 IN CF4-H2 MIXED GAS PLASMA

被引:0
|
作者
ARIKADO, T [1 ]
HORIUCHI, S [1 ]
机构
[1] NICHIDEN TOSHIBA INFORMAT SYST INC,KAWASAKI CITY,KANAGAWA 210,JAPAN
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C88 / C88
页数:1
相关论文
共 50 条
  • [31] ETCHING CHARACTERISTICS OF SIO2 IN CHF3 GAS PLASMA
    TOYODA, H
    KOMIYA, H
    ITAKURA, H
    JOURNAL OF ELECTRONIC MATERIALS, 1980, 9 (03) : 569 - 584
  • [32] EFFECTS OF CF4 PLASMA-ETCHING OF SIO2 ON THE PROPERTIES OF MOS STRUCTURES FORMED ON THE REMAINING SIO2-FILMS
    TOKUDA, Y
    YAMANE, H
    USAMI, A
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1985, 18 (01) : L1 - L4
  • [33] CHEMICAL ETCHING OF SIO2 BY CF4 AT LOW-PRESSURE - DOES IT DEPEND ON THE PLASMA CHEMISTRY
    HERSHKOWITZ, N
    DING, J
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1993, 206 : 63 - IEC
  • [34] APPLICABILITY OF THE B-INVARIANT SIMILARITY THEORY FOR THE ETCHING PROCESS OF SIO2 IN CF4 PLASMA
    MAKSIMOV, AI
    TROSTIN, AN
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, 1984, 27 (03): : 378 - 380
  • [35] Isotropic Plasma Etching of SiO2 Films
    Kovalevskii A.A.
    Malyshev V.S.
    Tsybul'skii V.V.
    Sorokin V.M.
    Russian Microelectronics, 2002, 31 (5) : 290 - 294
  • [36] NEAR-SURFACE DAMAGE AND CONTAMINATION AFTER CF4-H2 REACTIVE ION ETCHING OF SI
    OEHRLEIN, GS
    TROMP, RM
    TSANG, JC
    LEE, YH
    PETRILLO, EJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) : 1441 - 1447
  • [37] MECHANISMS OF ETCHING AND POLYMERIZATION IN RADIOFREQUENCY DISCHARGES OF CF4-H2,CF4-C2F4,C2F6-H2,C3F8-H2
    DAGOSTINO, R
    CRAMAROSSA, F
    COLAPRICO, V
    DETTOLE, R
    JOURNAL OF APPLIED PHYSICS, 1983, 54 (03) : 1284 - 1288
  • [38] Plasma chemical behaviour of reactants and reaction products during inductively coupled CF4 plasma etching of SiO2
    Fukumoto, Hiroshi
    Fujikake, Isao
    Takao, Yoshinori
    Eriguchi, Koji
    Ono, Kouichi
    PLASMA SOURCES SCIENCE & TECHNOLOGY, 2009, 18 (04):
  • [39] FEATURES OF SiO2 REACTIVE-ION ETCHING KINETICS IN CF4
    Efremov, Alexander M.
    Sobolev, Alexander M.
    Kwon, Kwang-Ho
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, 2020, 63 (09): : 21 - 27
  • [40] Mechanism of selective SiO2/photoresist reactive ion etching in an inductively coupled plasma operated in a C4F8/H2 gas mixture
    Nesterenko, Iurii
    Kalas, Benjamin
    Dao, Thang Duy
    Schulze, Julian
    Andrianov, Nikolai
    APPLIED PHYSICS LETTERS, 2025, 126 (03)