THICK-FILM MICROCIRCUIT LABORATORY

被引：1

作者：

LUCAS, MSP ^{[1
]}

DAWES, WH ^{[1
]}

机构：

[1] KANSAS STATE UNIV,DEPT ELECT ENGN,MANHATTAN,KS 66502

来源：

关键词：

D O I：

10.1109/TE.1973.4320825

中图分类号：

G40 [教育学];

学科分类号：

040101 ; 120403 ;

摘要：

引用

页码：130 / 137

页数：8

共 50 条

[31] CHARACTERIZATION OF THICK-FILM CAPICITORS
LEROY, Y
DESCAMPS, M
VERNET, M
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1977, 4 (3-4): : 125 - 131
[32] LASER AS A THICK-FILM TOOL
CORWIN, RE
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (09): : 713 - 713
[33] THICK-FILM COMPATIBLE TRANSISTORS
SINGH, A
[J]. JOURNAL OF SCIENTIFIC & INDUSTRIAL RESEARCH, 1977, 36 (03): : 118 - 120
[34] THICK-FILM CHIP CARRIERS
BYRUM, JE
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1983, 62 (08): : 876 - 876
[35] THICK-FILM CHIP CAPACITORS
AMIN, RB
BACHER, RJ
MCGONNELL, JP
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (04): : 355 - +
[36] ADHERENCE OF THICK-FILM CONDUCTORS
BECHER, PF
[J]. REPORT OF NRL PROGRESS, 1976, (DEC): : 36 - 37
[37] NEW THICK-FILM SENSORS
LEPPAVUORI, S
[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 193 - 197
[38] PRINTED THICK-FILM CAPACITORS
ISERT, H
[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1975, 83 (04): : 173 - 178
[39] SOLDERABILITY OF THICK-FILM METALLIZATIONS
BUBE, KR
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 325 - 326
[40] THICK-FILM HYDROGEN SENSOR
MISHRA, VN
AGARWAL, RP
[J]. SENSORS AND ACTUATORS B-CHEMICAL, 1994, 21 (03) : 209 - 212