PRINTED THICK-FILM CAPACITORS

被引:0
|
作者
ISERT, H [1 ]
机构
[1] TELEFONBAU & NORM GMBH,MAINZER LANDSTR 128-146,FRANKFORD,FED REP GER
来源
F&M-FEINWERKTECHNIK & MESSTECHNIK | 1975年 / 83卷 / 04期
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:173 / 178
页数:6
相关论文
共 50 条
  • [1] Embedding ceramic thick-film capacitors into printed wiring boards
    Borland, W
    Doyle, M
    Dellis, L
    Renovales, O
    Majumdar, D
    [J]. Materials, Integration and Packaging Issues for High-Frequency Devices II, 2005, 833 : 143 - 151
  • [2] THICK-FILM CHIP CAPACITORS
    AMIN, RB
    BACHER, RJ
    MCGONNELL, JP
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (04): : 355 - +
  • [3] Printed thick-film thermocouple sensors
    Duby, S
    Ramsey, B
    Harrison, DJ
    [J]. ELECTRONICS LETTERS, 2005, 41 (06) : 312 - 314
  • [4] THICK-FILM TERMINATIONS FOR MULTILAYER CERAMIC CAPACITORS
    BURKE, DP
    STUPAK, RE
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
  • [5] THICK-FILM GLASS-CERAMIC CAPACITORS
    BIGGERS, JV
    STRICKLER, DW
    MARSHALL, GL
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1968, 47 (04): : 393 - +
  • [6] THICK-FILM GLASS-CERAMIC CAPACITORS
    BIGGERS, JV
    MARSHALL, GL
    STRICKLER, DW
    [J]. SOLID STATE TECHNOLOGY, 1970, 13 (05) : 63 - +
  • [7] Thick-film thermistors printed on LTCC tapes
    Zhong, JH
    Bau, HH
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 2001, 80 (10): : 39 - 42
  • [8] TEMPERATURE CONTROL OF THICK-FILM PRINTED HEATERS
    BENAMMAR, M
    MASKELL, WC
    [J]. JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1989, 22 (11): : 933 - 936
  • [9] Printed nanoparticulate composites for silicon thick-film electronics
    Britton, D. T.
    Härting, M.
    [J]. PURE AND APPLIED CHEMISTRY, 2006, 78 (09) : 1723 - 1739
  • [10] SCREEN PRINTED THICK-FILM NICKEL SILICON INTERACTION
    SINGH, A
    PRUDENZIATI, M
    MORTEN, B
    BOSI, M
    [J]. MICROELECTRONICS AND RELIABILITY, 1985, 25 (05): : 889 - 893