ADHERENCE OF THICK-FILM CONDUCTORS

被引：0

作者：

BECHER, PF ^{[1
]}

机构：

[1] NAVAL RES LAB,DIV ENGN MAT,WASHINGTON,DC 20375

来源：

REPORT OF NRL PROGRESS | 1976年 / DEC期

关键词：

D O I：

暂无

中图分类号：

O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];

学科分类号：

07 ; 0710 ; 09 ;

摘要：

引用

页码：36 / 37

页数：2

共 50 条

[1] ADVANCES IN THICK-FILM CONDUCTORS
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[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 325 - 325
[2] ADHESION MECHANISMS OF THICK-FILM CONDUCTORS
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[J]. SOLID STATE TECHNOLOGY, 1979, 22 (03) : 62 - 66
[3] COST EFFICIENCY OF THICK-FILM CONDUCTORS
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[J]. SOLID STATE TECHNOLOGY, 1979, 22 (01) : 74 - 80
[5] MICROWAVE CONDUCTIVITY OF THICK-FILM CONDUCTORS
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[8] RELIABILITY OF THICK-FILM CONDUCTORS IN HUMID ENVIRONMENT
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[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (03): : 402 - 402
[9] SILVER-PALLADIUM THICK-FILM CONDUCTORS
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[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (12) : 3051 - 3072
[10] THICK-FILM CONDUCTORS FROM GENERIC ORGANOMETALLIC PRECURSORS
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