ADHESION MECHANISMS OF THICK-FILM CONDUCTORS

被引：0

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作者：

KIM, HG

ROTHLINGSHOFER, W

TOMANDL, G

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来源：

SOLID STATE TECHNOLOGY | 1979年 / 22卷 / 03期

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中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

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页码：62 / 66

页数：5

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