共 50 条
- [31] Cooling Method for High Power Dissipation SMD Packages 2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2017,
- [32] Thermal Analysis and Improvement of High Power Electronic Packages 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 27 - 31
- [33] Accurate Theta jc Measurement for High Power Packages 2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2011, : 208 - 215
- [35] POWER MOSFET PACKAGES TAKE NEW DIRECTIONS. Electronic Products (Garden City, New York), 1988, 31 (08): : 35 - 38
- [36] Cu-Sintering on Organic Packages for Power Modules 2022 International Conference on Electronics Packaging, ICEP 2022, 2022, : 151 - 152
- [37] Power Packages Interconnections for High Reliability Automotive Applications 49TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2019), 2019, : 35 - 39
- [38] An evaluation of board-mounted power module packages APEC 2002: SEVENTEENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 23, 2002, : 112 - 118
- [40] Diode packages squeeze more power into tight spaces ELECTRONIC PRODUCTS MAGAZINE, 1998, 41 (04): : 26 - +