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- [43] Data Driven Prognostics for Failure of Power Semiconductor Packages 2018 41ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2018,
- [44] Comparison of Thermal Behaviour of Commercial Packages for Power Devices 2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC, 2023,
- [46] Ribbon bonding - A scalable interconnect for power QFN packages 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 47 - +
- [47] Block Thermal Model for High Power Lidded Packages IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1745 - 1749
- [49] Hopes high for off-the-shelf power packages Diesel and Gas Turbine Worldwide, 2006, 38 (10): : 62 - 63
- [50] Modeling for Defects Impact on Electrical Performance of Power Packages 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 403 - 410