GROWTH OF ALLOY LAYER BETWEEN SOLID COPPER AND LIQUID TIN

被引:18
|
作者
KAWAKATSU, I
OSAWA, T
YAMAGUCHI, H
机构
[1] AOYAMAGAKUIN UNIV, FAC SCI & TECHNOL, DEPT MECH ENGN, TOKYO, JAPAN
[2] MITSUI MET MIN CO LTD, CENT RES, TOKYO, JAPAN
[3] MITSUI MET MIN CO LTD, CENT RES LAB, TOKYO, JAPAN
来源
关键词
D O I
10.2320/matertrans1960.13.436
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:436 / 443
页数:8
相关论文
共 50 条
  • [41] A note on a suggested intermetalltc reaction in a liquid antimony-copper tin-lead alloy
    Seager, GC
    Thompson, FC
    PHILOSOPHICAL MAGAZINE, 1938, 25 (172): : 1104 - 1107
  • [42] PROGRAMMED ELECTROPLATING OF A MICROLAYER TIN COPPER ALLOY
    KOSTIN, NA
    ZAMURNIKOV, VM
    PROTECTION OF METALS, 1992, 28 (05): : 639 - 641
  • [43] Tin plated copper alloy materials for connectors
    Masago, Yasushi
    Taira, Koichi
    R and D: Research and Development Kobe Steel Engineering Reports, 2009, 59 (01): : 133 - 136
  • [44] Role of the contact layer between liquid and solid on a solidification process
    Lipnicki, Z
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2003, 46 (12) : 2149 - 2154
  • [45] FUNCTIONAL COPPER-TIN ALLOY PLATING
    MISSEL, L
    PLATING AND SURFACE FINISHING, 1978, 65 (10): : 36 - 40
  • [46] Some Thermal Properties of a Copper–Tin Alloy
    B. J. Monaghan
    J. G. J. Neale
    L. Chapman
    International Journal of Thermophysics, 1999, 20 : 1051 - 1060
  • [47] MUTUAL DIFFUSION OF TIN AND COPPER IN THE SYSTEM COPPER-GALVANIC COATING OF TIN ALLOY.
    Slepushkin, V.V.
    Mukovnina, G.S.
    Yartsev, M.G.
    1984, (20):
  • [48] The relationship between residual stress and process parameters in TiN coatings on copper alloy substrates
    Carrasco, CA
    Vergara, V
    Benavente, R
    Mingolo, N
    Ríos, JC
    MATERIALS CHARACTERIZATION, 2002, 48 (01) : 81 - 88
  • [49] Hydrogen interaction with solid and liquid tin
    Nemanic, V.
    Zumer, M.
    Zavasnik, J.
    Cvebar, U.
    JOURNAL OF NUCLEAR MATERIALS, 2024, 588
  • [50] Evaluation of pure tin plated copper alloy substrates for tin whiskers
    Mathew, Sony
    Osterman, Michael
    Pecht, Michael
    Dunlevey, Frank
    CIRCUIT WORLD, 2009, 35 (01) : 3 - 8