GROWTH OF ALLOY LAYER BETWEEN SOLID COPPER AND LIQUID TIN

被引：18
|
作者：
KAWAKATSU, I
OSAWA, T
YAMAGUCHI, H
机构：
[1] AOYAMAGAKUIN UNIV, FAC SCI & TECHNOL, DEPT MECH ENGN, TOKYO, JAPAN
[2] MITSUI MET MIN CO LTD, CENT RES, TOKYO, JAPAN
[3] MITSUI MET MIN CO LTD, CENT RES LAB, TOKYO, JAPAN
来源：
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS | 1972年 / 13卷 / 06期
关键词：
D O I：
10.2320/matertrans1960.13.436
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：436 / 443
页数：8
相关论文
共 50 条
  • [21] The Contact Potential between liquid and solid in the Tin Melting Point
    Kurzke, H.
    Rottgardt, J.
    ZEITSCHRIFT FUR PHYSIK, 1938, 109 (5-6): : 341 - 348
  • [22] Effect of liquid structural transition on the dissolution of solid copper in liquid eutectic tin-bismuth
    Ding, Guo-Hua
    Qi, Xuan
    Liu, Shu-Long
    Li, Ming
    Hu, Jing
    JOURNAL OF MATERIALS RESEARCH, 2016, 31 (08) : 1145 - 1152
  • [23] Early Stage of Solid State Interfacial Reaction between Copper and Tin
    Maeda, Masakatsu
    Inoue, Naoto
    Sato, Takaaki
    Takahashi, Yasuo
    DIFFUSION IN SOLIDS AND LIQUIDS IV, 2009, 283-286 : 323 - 328
  • [24] MUTUAL DIFFUSION OF TIN AND COPPER IN THE SYSTEM COPPER GALVANIC COATING OF TIN ALLOY
    SLEPUSHKIN, VV
    MUKOVNINA, GS
    YARTSEV, MG
    PROTECTION OF METALS, 1984, 20 (06): : 718 - 722
  • [25] Nature and growth of interaction layer formed during the reaction between solid Ni and liquid Al
    Xu, Qiangang
    Zhang, Haifeng
    Ding, Bingzhe
    Hu, Zhuangqi
    Journal of Materials Science and Technology, 2002, 18 (06): : 512 - 515
  • [26] Diffusion of Tin in a Solid Solution of the Copper–Tin System
    V. P. Nikulkina
    A. O. Rodin
    B. S. Bokshtein
    Russian Journal of Non-Ferrous Metals, 2020, 61 : 291 - 296
  • [27] FORMATION OF COPPER-TIN ALLOY
    PILNIKOV, VP
    OSYAGINA, VA
    ZHURNAL FIZICHESKOI KHIMII, 1979, 53 (05): : 1171 - 1175
  • [28] SOLID-STATE INTERMETALLIC COMPOUND LAYER GROWTH BETWEEN COPPER AND HOT DIPPED INDIUM COATINGS
    VIANCO, PT
    KILGO, AC
    GRANT, R
    JOURNAL OF MATERIALS SCIENCE, 1995, 30 (19) : 4871 - 4878
  • [29] Behaviour of the solid alloy particles dispersed in liquid tin under the electric current passage
    Raitchenko, AI
    Popov, VP
    Derevyanko, AV
    FLUID FLOW PHENOMENA IN METALS PROCESSING, 1999, : 603 - 606
  • [30] Successive determination of lead, tin and copper in lead tin copper ternary alloy coating
    Diandu Yu Jingshi/Plating & Finishing, 19 (05):
12345