GROWTH OF ALLOY LAYER BETWEEN SOLID COPPER AND LIQUID TIN

被引:18
|
作者
KAWAKATSU, I
OSAWA, T
YAMAGUCHI, H
机构
[1] AOYAMAGAKUIN UNIV, FAC SCI & TECHNOL, DEPT MECH ENGN, TOKYO, JAPAN
[2] MITSUI MET MIN CO LTD, CENT RES, TOKYO, JAPAN
[3] MITSUI MET MIN CO LTD, CENT RES LAB, TOKYO, JAPAN
来源
关键词
D O I
10.2320/matertrans1960.13.436
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:436 / 443
页数:8
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