ANNEALING BEHAVIOR OF SILICON-NITRIDE AND SILICON OXYNITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD

被引:6
|
作者
KAMADA, T [1 ]
HIRAO, T [1 ]
KITAGAWA, M [1 ]
SETSUNE, K [1 ]
WASA, K [1 ]
IZUMI, T [1 ]
机构
[1] TOKAI UNIV,FAC ENGN,DEPT ELECTR,HIRATSUKA,KANAGAWA 25912,JAPAN
关键词
D O I
10.1016/0169-4332(88)90421-7
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
引用
收藏
页码:1094 / 1100
页数:7
相关论文
共 50 条
  • [1] PROPERTIES OF SILICON OXYNITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD
    HIRAO, T
    SETSUNE, K
    KITAGAWA, M
    KAMADA, T
    OHMURA, T
    WASA, K
    IZUMI, T
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1988, 27 (01): : L21 - L23
  • [2] HYDROGEN CONCENTRATION AND BOND CONFIGURATIONS IN SILICON-NITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD
    HIRAO, T
    SETSUNE, K
    KITAGAWA, M
    KAMADA, T
    WASA, K
    TSUKAMOTO, K
    IZUMI, T
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1988, 27 (01): : 30 - 34
  • [3] INFLUENCE OF DEPOSITION CONDITIONS ON THE PROPERTIES OF SILICON-NITRIDE FILMS PREPARED BY THE ECR PLASMA CVD METHOD
    HIRAO, T
    SETSUNE, K
    KITAGAWA, M
    KAMADA, T
    WASA, K
    IZUMI, T
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1987, 26 (12): : 2015 - 2021
  • [4] THERMAL-STABILITY OF HYDROGEN IN SILICON-NITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD
    HIRAO, T
    KAMADA, T
    KITAGAWA, M
    SETSUNE, K
    WASA, K
    MATSUDA, A
    TANAKA, K
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1988, 27 (04): : 528 - 533
  • [5] THE ROLE OF COMPOSITION IN THE PROPERTIES OF PLASMA CVD SILICON-NITRIDE AND OXYNITRIDE PASSIVATION FILMS
    SACHDEV, S
    BAERG, B
    GARGINI, PA
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) : C95 - C96
  • [6] PROPERTIES OF SILICON-NITRIDE AND SILICON OXYNITRIDE FILMS PREPARED BY REACTIVE SPUTTERING
    MIRSCH, S
    BAUER, J
    [J]. PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1974, 26 (02): : 579 - 584
  • [7] SILICON-NITRIDE AND OXYNITRIDE FILMS
    HABRAKEN, FHPM
    KUIPER, AET
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 1994, 12 (03): : 123 - 175
  • [8] ION-BEAM ANALYSIS OF THE CONCENTRATION AND THERMAL RELEASE OF HYDROGEN IN SILICON-NITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD
    KUROI, T
    UMEZAWA, K
    YAMANE, J
    SHOJI, F
    OURA, K
    HANAWA, T
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1988, 27 (08): : 1406 - 1410
  • [9] SINTERING AND MICROSTRUCTURE OF SILICON-NITRIDE PREPARED BY PLASMA CVD
    MORIYOSHI, Y
    FUTAKI, M
    EKINAGA, N
    NAKATA, T
    [J]. JOURNAL OF MATERIALS SCIENCE, 1992, 27 (16) : 4477 - 4482
  • [10] ROLE OF IONS AND RADICAL SPECIES IN SILICON-NITRIDE DEPOSITION BY ECR PLASMA CVD METHOD
    HIRAO, T
    SETSUNE, K
    KITAGAWA, M
    MANABE, Y
    WASA, K
    KOHIKI, S
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1987, 26 (05): : L544 - L546