共 50 条
- [22] A CPU CHIP-ON-BOARD MODULE IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01): : 115 - 118
- [24] Failure Analysis of a Chip Carrier Board 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 97 - 99
- [25] Wireless Interconnect for Board and Chip Level DESIGN, AUTOMATION & TEST IN EUROPE, 2013, : 958 - 963
- [28] Thermal analysis of a chip on board (COB) THIRTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 1997, 1997, : 112 - 118
- [30] Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy MICROELECTRONICS AND RELIABILITY, 1996, 36 (11-12): : 1803 - 1806