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- [37] 3D packaging - Combining chip on chip (COC) and chip on board (COB) packages - Process and design considerations 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 1210 - 1213
- [38] Compact Simulation of Chip-to-Chip Active Noise Coupling on a System PCB Board IEEE LETTERS ON ELECTROMAGNETIC COMPATIBILITY PRACTICE AND APPLICATIONS, 2020, 2 (01): : 15 - 20
- [39] Single-chip system solution reduces chip count for FDDI test board Electronic Engineering (London), 1994, 66 (806): : 14 - 16
- [40] Laser removal of flux residue before chip attachment to board in a flip chip assembly JOURNAL OF ELECTRONICS MANUFACTURING, 1998, 8 (3-4): : 173 - 179