HIGH-DENSITY PACKAGING TECHNOLOGY ULTRA THIN PACKAGE + NEW TAB PACKAGE

被引：3
|
作者：
NAKAGAWA, O
SHIMAMOTO, H
UEDA, T
SHIMOMURA, K
HATA, T
TACHIKAWA, T
FUKUSHIMA, J
BANJO, T
YAMAMOTO, I
机构：
[1] MITSUBISHI ELECTR CO,DEPT QUAL ASSURANCE,KITA ITAMI WORKS,ITAMI,HYOGO 664,JAPAN
[2] MITSUBISHI ELECTR CO,DEPT SEMICOND EQUIPMENT,FUKUOKA WORKS,FUKUOKA,JAPAN
[3] MITSUBISHI ELECTR CO,SAGAMI WORKS,SAGAMI,JAPAN
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1989年 / 18卷 / 05期
关键词：
D O I：
10.1007/BF02657479
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：633 / 643
页数：11
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