THIN PACKAGE OF LSI BY TRANSFERRED BUMP TAB TECHNOLOGY

被引：0
|
作者：
KAWAKITA, T
HATADA, K
机构：
来源：
IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS | 1991年 / 74卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the transferred bump TAB (Tape Automated Bonding) technology, the bumps are transferred on the film leads, and these bumps and the aluminum electrode of an LSI chip are gang-bonded together. This technology make possible a compact semiconductor package of low cost and high reliability. In this technology, the bump formation technology and the substrate technology for the bump formation and the bonding technology contribute to its important element technology. In this treatise, the substrate technology for the bump formation and the bump formation technology corresponding to multielectrodes transferred bump TAB package will be addressed. In addition, an application for TAB package of 100-mu-m pitch, 444-pin will be presented.
引用
收藏
页码：2349 / 2354
页数：6
相关论文
共 50 条
  • [1] NEW FILM CARRIER ASSEMBLY TECHNOLOGY - TRANSFERRED BUMP TAB
    HATADA, K
    FUJIMOTO, H
    MATSUNAGA, K
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (03): : 335 - 340
  • [2] HIGH-DENSITY PACKAGING TECHNOLOGY ULTRA THIN PACKAGE + NEW TAB PACKAGE
    NAKAGAWA, O
    SHIMAMOTO, H
    UEDA, T
    SHIMOMURA, K
    HATA, T
    TACHIKAWA, T
    FUKUSHIMA, J
    BANJO, T
    YAMAMOTO, I
    JOURNAL OF ELECTRONIC MATERIALS, 1989, 18 (05) : 633 - 643
  • [3] FINE-PITCH TAB-LSI INTERCONNECTION TECHNOLOGY IN MCM
    MORI, F
    KUDO, K
    TSUKAMOTO, K
    NEC RESEARCH & DEVELOPMENT, 1993, 34 (04): : 483 - 503
  • [4] Micro-metal bonding technology for LSI package
    Miura, K
    Serizawa, K
    MATERIALS SCIENCE RESEARCH INTERNATIONAL, 2001, 7 (02): : 127 - 131
  • [5] THIN-FILM AND PACKAGE PROCESSING ASPECTS OF JOSEPHSON LSI
    VANDERHOEVEN, BJ
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (03): : 841 - 842
  • [6] FINE PITCH TAB TECHNOLOGY WITH STRAIGHT SIDE WALL BUMP STRUCTURE FOR LCD PANEL
    TAKEDA, S
    EZAWA, H
    KUROMARU, A
    KAWADE, K
    TAKAGI, Y
    SUZUKI, Y
    IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 1989, 35 (03) : 343 - 351
  • [7] FINE PITCH TAB TECHNOLOGY WITH STRAIGHT SIDE-WALL BUMP STRUCTURE FOR LCD PANEL
    TAKEDA, S
    IMAMURA, M
    ARAI, T
    EZAWA, H
    KUROMARU, A
    INOUE, Y
    KAWADE, K
    TAKAGI, Y
    SUZUKI, Y
    UTAGAWA, T
    MURAMOTO, A
    IEEE 89 INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS: DIGEST OF TECHNICAL PAPERS, 1989, 8 : 266 - 267
  • [8] Cu Bump Flip Chip Package Reliability on 28nm Technology
    Tsao, P. H.
    Hsu, Steven
    Kuo, Y. L.
    Chen, J. H.
    Chang, Abel
    Pu, H. P.
    Chu, L. H.
    Lii, M. J.
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1148 - 1153
  • [9] TAB PACKAGE AIMS FOR 224 LEADS
    FIELDS, SW
    ELECTRONICS-US, 1983, 56 (02): : 56 - 56
  • [10] Reliability of Thin Seamless Package with Embedded High-Pin-Count LSI Chip
    Mori, Kentaro
    Kikuchi, Katsumi
    Ohshima, Daisuke
    Nakashima, Yoshiki
    Yamamichi, Shintaro
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 36 - 39
12345