THIN PACKAGE OF LSI BY TRANSFERRED BUMP TAB TECHNOLOGY

被引：0
|
作者：
KAWAKITA, T
HATADA, K
机构：
来源：
IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS | 1991年 / 74卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the transferred bump TAB (Tape Automated Bonding) technology, the bumps are transferred on the film leads, and these bumps and the aluminum electrode of an LSI chip are gang-bonded together. This technology make possible a compact semiconductor package of low cost and high reliability. In this technology, the bump formation technology and the substrate technology for the bump formation and the bonding technology contribute to its important element technology. In this treatise, the substrate technology for the bump formation and the bump formation technology corresponding to multielectrodes transferred bump TAB package will be addressed. In addition, an application for TAB package of 100-mu-m pitch, 444-pin will be presented.
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页码：2349 / 2354
页数：6
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