CERAMIC FIBER FLUOROPOLYMER COMPOSITES FOR ELECTRONIC PACKAGING MATERIALS

被引：0
|
作者：
BOLT, JD
机构：
来源：
PROCESSING SCIENCE OF ADVANCED CERAMICS | 1989年 / 155卷
关键词：
D O I：
10.1557/PROC-155-149
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：149 / 154
页数：6
相关论文
共 50 条
  • [1] Ceramic materials for electronic packaging
    Rabinovich, E.M., 1600, (111):
  • [2] CERAMIC-METAL REACTIONS IN COMPOSITES, CERAMIC JOINING, AND ELECTRONIC PACKAGING
    LOEHMAN, RE
    SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (08): : 965 - 970
  • [3] NANO MATERIALS AND COMPOSITES FOR ELECTRONIC AND PHOTO PACKAGING
    Li, Yi
    Zhang, R.
    Zhu, Lingbo
    Lin, W.
    Hildreth, O.
    Jiang, Hongjin
    Lu, Jiongxin
    Xiu, Yonghao
    Liu, Y.
    Moon, J.
    Wong, C. P.
    2009 9TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2009, : 1 - 3
  • [4] CERAMIC-FIBER POLYMER COMPOSITES FOR ELECTRONIC SUBSTRATES
    BOLT, JD
    BUTTON, DP
    YOST, BA
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 109 : 207 - 211
  • [5] Cu-SiCp composites as advanced electronic packaging materials
    Azmi, K.
    Derman, M. N.
    Al Bakri, A. M. Mustafa
    Sandu, A. V.
    ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY II, 2014, 594-595 : 852 - +
  • [6] Electronic packaging, ceramic and thick and thin film to lead electronic materials market in 2000
    InterCeram: International Ceramic Review, 1998, 47 (03):
  • [7] CERAMIC MATERIALS AND CERAMIC COMPOSITES
    BOCH, P
    CHERMANT, JL
    ALBUGUE, F
    BERNIER, JC
    COLOMBIER, M
    COMBESCURE, P
    CRISTIN, M
    FONDERE, JP
    GOURSAT, A
    ODIER, P
    POISSON, R
    ROUBY, P
    SIMONET, W
    ANNALES DE CHIMIE-SCIENCE DES MATERIAUX, 1989, 14 (5-7): : 371 - 374
  • [8] MATERIALS FOR ELECTRONIC PACKAGING
    LANDO, DJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (03) : C91 - C91
  • [9] Electronic packaging materials
    Zweben, C
    ADVANCED MATERIALS & PROCESSES, 2005, 163 (10): : 33 - 37
  • [10] Advanced composites and other advanced materials for electronic packaging thermal management
    Zweben, C
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 360 - 365
12345