Ceramic materials for electronic packaging

被引：0

作者：

机构：

[1] Rabinovich, E.M.

来源：

Rabinovich, E.M. | 1600年 / 111期

关键词：

Electronics Packaging;

D O I：

暂无

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学科分类号：

摘要：

引用

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[1] CERAMIC FIBER FLUOROPOLYMER COMPOSITES FOR ELECTRONIC PACKAGING MATERIALS
BOLT, JD
PROCESSING SCIENCE OF ADVANCED CERAMICS, 1989, 155 : 149 - 154
[2] Electronic packaging, ceramic and thick and thin film to lead electronic materials market in 2000
InterCeram: International Ceramic Review, 1998, 47 (03):
[3] MATERIALS FOR ELECTRONIC PACKAGING
LANDO, DJ
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (03) : C91 - C91
[4] Electronic packaging materials
Zweben, C
ADVANCED MATERIALS & PROCESSES, 2005, 163 (10): : 33 - 37
[5] MATERIALS IN ELECTRONIC MANUFACTURING - ELECTRONIC PACKAGING
PFAHL, RC
MRS BULLETIN, 1992, 17 (04) : 38 - 41
[6] MATERIALS IN ELECTRONIC PACKAGING AT APL
CHARLES, HK
JOHNS HOPKINS APL TECHNICAL DIGEST, 1993, 14 (01): : 51 - 67
[7] Materials in electronic packaging at APL
Charles Jr., Harry K.
Johns Hopkins APL Technical Digest (Applied Physics Laboratory), 1993, 14 (01): : 51 - 67
[8] Biostability of electronic packaging materials
Beshchasna, Natalia
Uhlemann, Juergen
Wolter, Klaus-Juergen
ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 1047 - +
[9] CHARACTERIZATION OF ELECTRONIC CERAMIC MATERIALS
MOUNTVAL.AJ
RUBIN, GA
ULRICH, DR
AMERICAN CERAMIC SOCIETY BULLETIN, 1966, 45 (08): : 754 - &
[10] CERAMIC-METAL REACTIONS IN COMPOSITES, CERAMIC JOINING, AND ELECTRONIC PACKAGING
LOEHMAN, RE
SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (08): : 965 - 970