CERAMIC FIBER FLUOROPOLYMER COMPOSITES FOR ELECTRONIC PACKAGING MATERIALS

被引：0

作者：

BOLT, JD

机构：

来源：

PROCESSING SCIENCE OF ADVANCED CERAMICS | 1989年 / 155卷

关键词：

D O I：

10.1557/PROC-155-149

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：149 / 154

页数：6

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