CERAMIC FIBER FLUOROPOLYMER COMPOSITES FOR ELECTRONIC PACKAGING MATERIALS

被引：0
|
作者：
BOLT, JD
机构：
来源：
PROCESSING SCIENCE OF ADVANCED CERAMICS | 1989年 / 155卷
关键词：
D O I：
10.1557/PROC-155-149
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：149 / 154
页数：6
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