PACKAGING AND ASSEMBLING TECHNIQUE IN MICROELECTRONICS

被引：0

作者：

TAKAHARA, K

机构：

来源：

ELECTRONICS & COMMUNICATIONS IN JAPAN | 1966年 / 49卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：127 / &

共 50 条

[21] Journal of Microelectronics and Electronic Packaging: Editorial
Bokil, Delip
Journal of Microelectronics and Electronic Packaging, 2005, 2 (04):
[22] HIGH-PERFORMANCE PACKAGING IN MICROELECTRONICS
BLODGETT, AJ
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03): : 777 - 778
[23] Journal of Microelectronics and Electronic Packaging: Editorial
Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109, United States
J. Microelectron. Electron. Packag., 2007, 4 (0i):
[24] Why microelectronics and packaging? Wireless applications
2001, IMAPS-International Microelectronics and Packaging Society, Washington, United States (28):
[25] How Microelectronics and Nanotechnology Will Shape Packaging
Brody, Aaron L.
FOOD TECHNOLOGY, 2012, 66 (02) : 73 - 75
[26] MODELING JOINING MATERIALS FOR MICROELECTRONICS PACKAGING
KIVILAHTI, JK
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 326 - 333
[27] Electrically Conductive Adhesives in Microelectronics Packaging
Ayalasomayajula, Mukund
Khurana, Mohit Ravi
Chaudhary, Prince Shiva
JOURNAL OF ELECTRONIC PACKAGING, 2024, 146 (04)
[28] TRENDS IN MICROELECTRONICS TECHNIQUE
YANAI, H
ELECTRONICS & COMMUNICATIONS IN JAPAN, 1966, 49 (04): : 12 - &
[29] INTRODUCTION TO MICROELECTRONICS TECHNIQUE
TAKAGI, N
ELECTRONICS & COMMUNICATIONS IN JAPAN, 1966, 49 (04): : 10 - &
[30] ELECTRONIC PACKAGING AND CORROSION - FORECAST - CORROSION IN MICROELECTRONICS
FRANKENTHAL, RP
MICROPROCESSING AND MICROPROGRAMMING, 1987, 19 (05): : 427 - 427

← 1 2 3 4 5 →