HIGH-PERFORMANCE PACKAGING IN MICROELECTRONICS

被引：0
|
作者：
BLODGETT, AJ [1 ]
机构：
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 03期
关键词：
D O I：
10.1116/1.573304
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：777 / 778
页数：2
相关论文
共 50 条
  • [1] High Performance Microelectronics Packaging Heat Sink Materials
    Guosheng, Jiang
    Kuang, Ken
    Zhu, Danny
    [J]. RF AND MICROWAVE MICROELECTRONICS PACKAGING, 2010, : 233 - +
  • [2] HIGH-PERFORMANCE PACKAGING MATERIALS
    ISHITANI, T
    [J]. JOURNAL OF THE JAPANESE SOCIETY FOR FOOD SCIENCE AND TECHNOLOGY-NIPPON SHOKUHIN KAGAKU KOGAKU KAISHI, 1990, 37 (06): : 493 - 494
  • [3] SOLID LOGIC TECHNOLOGY - VERSATILE HIGH-PERFORMANCE MICROELECTRONICS
    DAVIS, EM
    HARDING, WE
    SCHWARTZ, RS
    CORNING, JJ
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1964, 8 (02) : 102 - &
  • [4] INTERCONNECTION AND PACKAGING OF HIGH-PERFORMANCE ICS
    JENSEN, RJ
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1986, 192 : 20 - IAEC
  • [5] High-Performance Packaging of Power Electronics
    M. C. Shaw
    [J]. MRS Bulletin, 2003, 28 : 41 - 50
  • [6] HIGH-PERFORMANCE MMIC HERMETIC PACKAGING
    ZIEGNER, BA
    [J]. MICROWAVE JOURNAL, 1986, 29 (11) : 133 - &
  • [7] High-performance packaging of power electronics
    Shaw, MC
    [J]. MRS BULLETIN, 2003, 28 (01) : 41 - 50
  • [8] HIGH-PERFORMANCE POLYPROPYLENE FOR THE PACKAGING MARKET
    MITCHELL, EB
    BOSSAERT, BL
    [J]. TAPPI JOURNAL, 1992, 75 (06): : 79 - 81
  • [9] VMEBUS DEMANDS HIGH-PERFORMANCE PACKAGING
    LADUZINSKY, AJ
    [J]. CONTROL ENGINEERING, 1985, 32 (08) : 108 - 108
  • [10] HIGH-PERFORMANCE PACKAGING TECHNOLOGY FOR SUPERCOMPUTERS
    WATARI, T
    DOHYA, A
    [J]. IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS, 1991, 74 (08): : 2331 - 2336
12345