PACKAGING AND ASSEMBLING TECHNIQUE IN MICROELECTRONICS

被引：0
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作者：
TAKAHARA, K
机构：
来源：
ELECTRONICS & COMMUNICATIONS IN JAPAN | 1966年 / 49卷 / 04期
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：127 / &
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