PERFORMANCE OF BURIED NITRIDE CMOS DEVICES

被引:0
|
作者
ZIMMER, G [1 ]
VOGT, H [1 ]
NEUBERT, E [1 ]
STAKS, P [1 ]
机构
[1] UNIV DORTMUND,D-4600 DORTMUND 50,FED REP GER
关键词
D O I
10.1109/T-ED.1983.21403
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1606 / 1607
页数:2
相关论文
共 50 条
  • [21] High Performance CMOS FDSOI Devices activated at Low Temperature
    Pasini, L.
    Batude, P.
    Lacord, J.
    Casse, M.
    Mathieu, B.
    Sklenard, B.
    Luce, E. Piegas
    Micout, J.
    Payet, A.
    Mazen, F.
    Besson, P.
    Ghegin, E.
    Borrel, J.
    Daubriac, R.
    Hutin, L.
    Blachier, D.
    Barge, D.
    Chhun, S.
    Mazzocchi, V.
    Cros, A.
    Barnes, J-P.
    Saghi, Z.
    Delaye, V.
    Rambal, N.
    Lapras, V.
    Mazurier, J.
    Weber, O.
    Andrieu, F.
    Brunet, L.
    Fenouillet-Beranger, C.
    Rafhay, Q.
    Ghibaudo, G.
    Cristiano, F.
    Haond, M.
    Boeuf, F.
    Vinet, M.
    2016 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, 2016,
  • [22] CMOS Platform TEG for Development of High Performance Synaptic Devices
    An, Yeong-Jin
    Kim, Seong-Hyun
    Song, Ki-Woo
    Shin, Hyun-Jin
    Ryu, Tae-Gyu
    Eadi, Sunil-Babu
    Kwon, Hyuk-Min
    Lee, Hi-Deok
    2022 IEEE 34TH INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS), 2022, : 101 - 104
  • [23] CMOS Compatible High Performance IIIV Devices: Opportunities and Challenges
    Sun, Y.
    Shiu, K. T.
    Cheng, C. W.
    Majumdar, A.
    Bruce, R.
    Yau, J. B.
    Farmer, D.
    Zhu, Y.
    Hopstaken, M.
    Frank, M. M.
    Ando, T.
    Lee, K. T.
    Rozen, J.
    Sadana, D. K.
    Narayanan, V.
    Mo, R. T.
    Leobandung, E.
    SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 6, 2016, 72 (04): : 313 - 319
  • [24] The role of extended defects on the performance of optoelectronic devices in nitride semiconductors
    Moustakas, Theodore D.
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2013, 210 (01): : 169 - 174
  • [25] Parylene to silicon nitride bonding for post-integration of high pressure microfluidics to CMOS devices
    Ciftlik, Ata Tuna
    Gijs, Martin A. M.
    LAB ON A CHIP, 2012, 12 (02) : 396 - 400
  • [26] Building Scalable Buried Interface for High-Performance Perovskite Photovoltaic Devices
    Yang, Min
    Qin, Zhenzhen
    Chen, Mengjiong
    Lin, Xuesong
    Luan, Xiangfeng
    Yang, Zhibin
    Han, Liyuan
    Wang, Yanbo
    ADVANCED FUNCTIONAL MATERIALS, 2024, 34 (37)
  • [27] Numerical investigation on seismic performance of a shallow buried underground structure with isolation devices
    Jianning Wang
    Guangyu Zhang
    Haiyang Zhuang
    Jing Yang
    Chen Li
    EarthquakeResearchAdvances, 2022, 2 (04) : 11 - 21
  • [28] THE CHARACTERISTICS OF CMOS DEVICES IN OXYGEN IMPLANTED SILICON-ON-INSULATOR - THE INFLUENCE OF THE MICROSTRUCTURE AT SILICON BURIED OXIDE INTERFACE
    MAO, BY
    CHEN, CE
    SUNDARESAN, R
    POLLACK, G
    JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (04) : A11 - A11
  • [29] RF Performance of 28nm PolySiON and HKMG CMOS Devices
    Chew, Kok Wai Johnny
    Agshikar, Aniket
    Wiatr, Maciej
    Wong, Jen Shuang
    Chow, Wai Heng
    Liu, Zhihong
    Lee, Ting Huang
    Shi, Jinglin
    Lim, Suh Fei
    Sundaram, Kumaran
    Chan, Lye Hock Kelvin
    Cheng, Chye Huat Michael
    Sassiat, Nicolas
    Yoo, Yong Koo
    Balijepalli, Asha
    Kumta, Amit
    Nguyen, Chi Dong
    Illgen, Ralf
    Mathew, Arun
    Schippel, Christian
    Romanescu, Alexandru
    Watts, Josef
    Harame, David
    PROCEEDINGS OF THE 2015 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC 2015), 2015, : 43 - 46
  • [30] Comparison of Analog and Noise Performance between Buried Channel versus Surface Devices in HKMG I/O Devices
    Pirro, L.
    Jayakumar, A.
    Zimmerhackl, O.
    Lipp, D.
    Illgen, R.
    Muehlhoff, A.
    Pfuetzner, R.
    Zaka, A.
    Otto, M.
    Hoentschel, J.
    Raffel, Y.
    Seidel, K.
    Olivo, R.
    2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2021,