MATERIAL AND PROCESSING TECHNOLOGIES OF POLYIMIDE FOR ADVANCED ELECTRONIC DEVICES

被引：13
|
作者：
ENDO, A
TAKADA, M
ADACHI, K
TAKASAGO, H
YADA, T
ONISHI, Y
机构：
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1987年 / 134卷 / 10期
关键词：
D O I：
10.1149/1.2100235
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：2522 / 2527
页数：6
相关论文
共 50 条
  • [1] MATERIAL AND PROCESSING TECHNOLOGIES OF POLYIMIDE FOR ADVANCED ELECTRONIC DEVICES
    ENDO, A
    TAKADA, M
    TAKASAGO, H
    SUGIURA, T
    YADA, T
    ONISHI, Y
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (08) : C314 - C314
  • [2] Processing Technologies for Advanced Ge Devices
    Loo, R.
    Hikavyy, A. Y.
    Witters, L.
    Schulze, A.
    Arimura, H.
    Cott, D.
    Mitard, J.
    Porret, C.
    Mertens, H.
    Ryan, P.
    Wall, J.
    Matney, K.
    Wormington, M.
    Favia, P.
    Richard, O.
    Bender, H.
    Horiguchi, N.
    Collaert, N.
    Thean, A.
    [J]. SIGE, GE, AND RELATED MATERIALS: MATERIALS, PROCESSING, AND DEVICES 7, 2016, 75 (08): : 491 - 503
  • [3] Processing Technologies for Advanced Ge Devices
    Loo, R.
    Hikavyy, A. Y.
    Witters, L.
    Schulze, A.
    Arimura, H.
    Cott, D.
    Mitard, J.
    Porret, C.
    Mertens, H.
    Ryan, P.
    Wall, J.
    Matney, K.
    Wormington, M.
    Favia, P.
    Richard, O.
    Bender, H.
    Thean, A.
    Horiguchi, N.
    Mocuta, D.
    Collaert, N.
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (01) : P14 - P20
  • [4] Advanced processing of GaN for electronic devices
    Cao, XA
    Pearton, SJ
    Ren, F
    [J]. CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 2000, 25 (04) : 279 - 390
  • [5] Through wafer interconnection technologies for advanced electronic devices
    de Samber, M
    Nellissen, T
    van Grunsven, E
    [J]. 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 1 - 6
  • [6] Applications of advanced materials technologies to vacuum electronic devices
    Calame, JP
    Abe, DK
    [J]. PROCEEDINGS OF THE IEEE, 1999, 87 (05) : 840 - 864
  • [7] Critical material and processing issues of SiC electronic devices
    Cooper, JA
    [J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1997, 44 (1-3): : 387 - 391
  • [8] OPTOELECTRONIC DEVICES AND MATERIAL TECHNOLOGIES FOR PHOTO-ELECTRONIC INTEGRATED SYSTEMS
    HAYASHI, I
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 (1B): : 266 - 271
  • [9] Advanced Electronic Cooling Technologies
    Wang, Yanjin
    Luo, Qinghai
    Chen, Xiaoming
    [J]. 2009 ASIA PACIFIC CONFERENCE ON POSTGRADUATE RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIMEASIA 2009), 2009, : 149 - 152
  • [10] Laser material interaction technologies for material processing
    Kathuria, YP
    [J]. OPTIKA '98 - 5TH CONGRESS ON MODERN OPTICS, 1998, 3573 : 88 - 95
12345