Advanced Electronic Cooling Technologies

被引：2
|
作者：
Wang, Yanjin [1 ]
Luo, Qinghai [1 ]
Chen, Xiaoming [1 ]
机构：
[1] Univ S China, Hengyang 421001, Peoples R China
来源：
2009 ASIA PACIFIC CONFERENCE ON POSTGRADUATE RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIMEASIA 2009) | 2009年
关键词：
electronic cooling; heat pipes; thermoelectric cooler; phase change cooling; micro channel; heat sink; MICROCHANNEL HEAT SINK; THERMOELECTRIC COOLERS; SINGLE-NOZZLE; PIPES; OPTIMIZATION; MODELS;
D O I：
10.1109/PRIMEASIA.2009.5397426
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces the research status of electronic cooling based on the development trend of the electronic technology. The technical characteristics of heat pipes, thermoelectric cooler, pahse change cooling and microchannel heat sink are analyzed. These technologies are advanced cooling methods for large power electronic equipments and high heat flux density electronic elements. However, different technique has different advantage and disadvantage. Reasonable selection and optimization of cooling technologies according to the characteristics of cooling objects.
引用
收藏
页码：149 / 152
页数：4
相关论文
共 50 条
  • [1] Advanced cooling technologies for microprocessors
    Kenny, Thomas W.
    Goodson, Kenneth E.
    Santiago, Juan G.
    Wang, Evelyn
    Koo, Jae-Mo
    Jiang, Linan
    Pop, Eric
    Sinha, Sanjiv
    Zhang, Lian
    Fogg, David
    Yao, Shuhuai
    Flynn, Roger
    Chang, Ching-Hsiang
    Hidrovo, Carlos H.
    [J]. FRONTIERS IN ELECTRONICS, 2006, 41 : 301 - +
  • [2] Advanced cooling textiles and technologies
    Zhao Xinhua
    [J]. China Textile., 2024, (04)
  • [3] Advanced cooling textile technologies for personal thermoregulation
    Jing, Yuanyuan
    Du, Minzhi
    Zhang, Pengyu
    Liang, Ziqi
    Du, Yong
    Yao, Lan
    Chen, Haisheng
    Zhang, Ting
    Zhang, Kun
    [J]. MATERIALS TODAY PHYSICS, 2024, 41
  • [4] Hydrocarbon fuel cooling technologies for advanced propulsion
    Sobel, DR
    Spadaccini, LJ
    [J]. JOURNAL OF ENGINEERING FOR GAS TURBINES AND POWER-TRANSACTIONS OF THE ASME, 1997, 119 (02): : 344 - 351
  • [5] Embedded Cooling Technologies For Densely Integrated Electronic Systems
    Sarvey, Thomas E.
    Zhang, Yang
    Zheng, Li
    Thadesar, Paragkumar
    Gutala, Ravi
    Cheung, Colman
    Rahman, Arifur
    Bakir, Muhannad S.
    [J]. 2015 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2015,
  • [6] Operational Enhancement of Electric Drives by Advanced Cooling Technologies
    Groschup, Benedikt
    Nell, Martin
    Hameyer, Kay
    [J]. 2019 IEEE WORKSHOP ON ELECTRICAL MACHINES DESIGN, CONTROL AND DAGNOSIS (WEMDCD), VOL 1, 2019, : 65 - 70
  • [7] Advanced cooling techniques comparison for airborne electronic circuits
    Assouad, Y
    Caplot, M
    Gautier, T
    [J]. THIRTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 1997, 1997, : 131 - 141
  • [8] Through wafer interconnection technologies for advanced electronic devices
    de Samber, M
    Nellissen, T
    van Grunsven, E
    [J]. 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 1 - 6
  • [9] Applications of advanced materials technologies to vacuum electronic devices
    Calame, JP
    Abe, DK
    [J]. PROCEEDINGS OF THE IEEE, 1999, 87 (05) : 840 - 864
  • [10] MATERIAL AND PROCESSING TECHNOLOGIES OF POLYIMIDE FOR ADVANCED ELECTRONIC DEVICES
    ENDO, A
    TAKADA, M
    TAKASAGO, H
    SUGIURA, T
    YADA, T
    ONISHI, Y
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (08) : C314 - C314
12345