OPTIMIZATION OF THE REQUIRED TEMPERATURE OF CONTACT SOLDERING OF ELECTRONIC DEVICES

被引：0
|
作者：
Shtennikov, V. N. [1 ]
Seleznev, V. D. [1 ]
机构：
[1] BN Yeltsin Ural Fed Univ, 19 Mir Str, Ekaterinburg 620002, Russia
来源：
JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS | 2013年 / 86卷 / 05期
关键词：
engineering physics; devices; soldering; temperature; heat conduction; time;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This paper presents the results of a complex of experimental and theoretical studies aimed at improving the quality of soldering electronic devices by optimizing the design-technological parameters.
引用
收藏
页码：1060 / 1065
页数：6
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