The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

被引：1
|
作者：
Shtennikov, V. N. [1 ]
Budai, B. T. [2 ]
机构：
[1] Eltsin Ural Fed Univ, Ekaterinburg, Russia
[2] Eltsin Ural Fed Univ, Inst Physicotech, Ekaterinburg, Russia
来源：
RUSSIAN JOURNAL OF NONDESTRUCTIVE TESTING | 2013年 / 49卷 / 03期
关键词：
defect; quality; diagnostics; comparison; heat transfer; soldering;
D O I：
10.1134/S1061830913030078
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints.
引用
收藏
页码：178 / 183
页数：6
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