Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte

被引：0
|
作者：
Mui Chee Liew
Ibrahym Ahmad
Liu Mei Lee
Muhammad Firdaus Mohd Nazeri
Habsah Haliman
Ahmad Azmin Mohamad
机构：
[1] School of Materials and Mineral Resources Engineering,
[2] Universiti Sains Malaysia,undefined
来源：
Metallurgical and Materials Transactions A | 2012年 / 43卷
关键词：
SnO2; Solder Joint; Corrosion Product; Passive Film; Potentiodynamic Polarization;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (Ecorr) and corrosion current density (icorr) obtained from the sample was –1.108 V vs Hg/HgO and 1.795 × 10−4 A cm−2, respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures.
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页码：3742 / 3747
页数：5
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