Experimental Results of Testing a BIST Σ–Δ ADC on the HOY Wireless Test Platform

High pin count packaging and 3D IC technology make testing such advanced ICs more and more difficult and expensive. The HOY wireless test platform provides an alternative and cost-effective test solution to address the poor accessibility and high test cost issues. The key idea is implementing a low-cost and short-distance wireless transceiver on chip so that all test instructions and data can be transmitted without physical access. Due to the limited wireless bandwidth, all modules in the device under test (DUT) are preferred to have some built-in self-test (BIST) features. Prior works successfully demonstrated that DUTs with memory and digital circuits can be tested on the low-cost wireless test platform. However, there is no example to show if it is also possible to test the DUT embedded with analog circuits on the HOY test platform. This paper demonstrates the first system-level integration including hardware and software for testing a fully-integrated BIST ADC on the HOY wireless test platform. The DUT chip fabricated in 0.18-μm CMOS consists of a second-order Σ–Δ ADC under test (AUT) and the BIST circuitry. The AUT design employs the decorrelating design-for-digital-testability (D3T) scheme to make itself digitally testable. The BIST design is based on the modified controlled sine wave fitting (CSWF) method. The required BIST circuits are purely digital and as small as 9.9k gates. The gate count of the HOY test wrapper is less than 1k. Experimental results obtained by the HOY wireless test platform show that the AUT achieves a dynamic range of 85.1 dB and a peak SNDR of 78.6 dB. The wireless test results show good agreement with those acquired by conventional analog tests.