Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

被引:0
|
作者
Max M. Shulaker
Gage Hills
Rebecca S. Park
Roger T. Howe
Krishna Saraswat
H.-S. Philip Wong
Subhasish Mitra
机构
[1] Stanford University,Department of Electrical Engineering
[2] Massachusetts Institute of Technology,Department of Electrical Engineering and Computer Science
[3] Stanford University,Department of Computer Science
来源
Nature | 2017年 / 547卷
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学科分类号
摘要
Multiple nanotechnologies are integrated on a single chip to realize a three-dimensional integrated circuit architecture that combines computing and data storage—a potentially transformative advance in computing.
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页码:74 / 78
页数:4
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