Reliable epoxy/SiC composite insulation coating for high-voltage power packaging

The development of a high-voltage power semiconductor device puts forward higher requirements for its electrical insulation materials. In this paper, an epoxy/SiC nonlinear field-dependent conductivity (FDC) coating material was reported to relieve its thermo-mechanical stresses during device operation. It was exciting that the coating could improve both partial discharge performance and insulation reliability for high-voltage power device packaging. This coating technology can improve the partial discharge inception voltage (PDIV) of power devices by a maximum of more than 86.2%. Based on the thermal shocking test, the PDIV of the device still exceeds 10 kV even after 1000 cycles. It was believed that the FDC insulation capable of forming a thin coating could be suitable for high-voltage power device packaging with good reliability because of reducing thermo-mechanical stresses greatly.