Reliable epoxy/SiC composite insulation coating for high-voltage power packaging

被引：0
|
作者：
Yu Liang
Gaojia Zhu
Guo-Quan Lu
Yun-Hui Mei
机构：
[1] Tianjin University,School of Materials Science and Engineering
[2] Tiangong University,School of Electrical Engineering
[3] Virginia Tech,Center for Power Electronics Systems, Bradley Department of Electrical and Computer Engineering, and the Department of Materials Science and Engineering
来源：
Journal of Materials Science: Materials in Electronics | 2022年 / 33卷
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摘要：
The development of a high-voltage power semiconductor device puts forward higher requirements for its electrical insulation materials. In this paper, an epoxy/SiC nonlinear field-dependent conductivity (FDC) coating material was reported to relieve its thermo-mechanical stresses during device operation. It was exciting that the coating could improve both partial discharge performance and insulation reliability for high-voltage power device packaging. This coating technology can improve the partial discharge inception voltage (PDIV) of power devices by a maximum of more than 86.2%. Based on the thermal shocking test, the PDIV of the device still exceeds 10 kV even after 1000 cycles. It was believed that the FDC insulation capable of forming a thin coating could be suitable for high-voltage power device packaging with good reliability because of reducing thermo-mechanical stresses greatly.
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页码：20508 / 20517
页数：9
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