Transaction-level modeling for architectural and power analysis of PowerPC and CoreConnect-based systems

被引:0
|
作者
Nagu Dhanwada
Reinaldo A. Bergamaschi
William W. Dungan
Indira Nair
Paul Gramann
William E. Dougherty
Ing-Chao Lin
机构
[1] IBM EDA Laboratory,Department of Computer Science
[2] IBM T. J. Watson Research Center,undefined
[3] IBM STG,undefined
[4] Pennsylvania State University,undefined
来源
关键词
SystemC; Transaction level modeling; Architecture modeling; Power analysis; PowerPC; CoreConnect;
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暂无
中图分类号
学科分类号
摘要
Transaction-Level models have emerged as an efficient way of modeling systems-on-chip, with acceptable simulation speed and modeling accuracy. Nevertheless, the high complexity of current architectures and bus protocols make it very challenging to develop and verify such models. This paper presents the transaction-level models developed at IBM for PowerPC and CoreConnect-based systems. These models can be simulated in a SystemC environment for functional verification and power estimation. Detailed transaction-based power models were developed. Comparisons between the simulated models and real hardware resulted in errors below 15% in timing accuracy, and below 11% in power estimation compared against gate-level power. These results demonstrate the efficiency of our transaction-level models for early analysis and design space exploration.
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页码:105 / 125
页数:20
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